Selamet, Sugeng (2009) The Effect of Cu Concentration on Unidirectional Solidification Process for Micro Structure of Al-Cu Alloy. Sains dan Teknologi, 2 (1). ISSN 1979-6870
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ABSTRACT: The objective of this research are to study the influence of Cu concentration on Al-Cu Alloy toward columnar microstructure and mechanical properties to pass unidirectional solidification process with free convection method. Al-( 2,2; 3,1; 4,4; and 4,7wt%Cu) in hypoeutectic alloy, were melted in the crucible furnace up to 700 0C and poured in the die mold stainless steel ( 100 mm length and in diameter 5 mm ). Unidirectional solidification was done with remelting Al-Cu in die mold that gave 7 mm in thick clay isolation, it used electric furnace up to 700 – 710 0C. Cooling process was done with water over chiller metal lighted under die mold. Material was tested namely microstructure, hardness and tensile strength test. The result shows that the increasing Cu concentration step columnar-dendrite microstructure forming on Al-(4,4 and 4,7wt%Cu), while Cu concentration (2,2 and 3,1wt%Cu) do not form columnar-dendrite microstructure.
Item Type: | Article |
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Kata Kunci: | unidirectional solidification, free convection, columnar-dendrite |
Subjects: | Teknologi > Teknik elektro, Teknik Nukllir Teknologi > T1 Teknologi (Umum) |
Program Studi: | Fakultas Teknik > S1 Teknik Elektro |
Depositing User: | Users 388 not found. |
Date Deposited: | 28 Feb 2012 06:15 |
Last Modified: | 28 Feb 2012 06:15 |
URI: | http://eprints.umk.ac.id/id/eprint/104 |
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