The Effect of Cu Concentration on Unidirectional Solidification Process for Micro Structure of Al-Cu Alloy

Selamet, Sugeng (2009) The Effect of Cu Concentration on Unidirectional Solidification Process for Micro Structure of Al-Cu Alloy. Sains dan Teknologi, 2 (1). ISSN 1979-6870

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    Abstrak

    ABSTRACT: The objective of this research are to study the influence of Cu concentration on Al-Cu Alloy toward columnar microstructure and mechanical properties to pass unidirectional solidification process with free convection method. Al-( 2,2; 3,1; 4,4; and 4,7wt%Cu) in hypoeutectic alloy, were melted in the crucible furnace up to 700 0C and poured in the die mold stainless steel ( 100 mm length and in diameter 5 mm ). Unidirectional solidification was done with remelting Al-Cu in die mold that gave 7 mm in thick clay isolation, it used electric furnace up to 700 – 710 0C. Cooling process was done with water over chiller metal lighted under die mold. Material was tested namely microstructure, hardness and tensile strength test. The result shows that the increasing Cu concentration step columnar-dendrite microstructure forming on Al-(4,4 and 4,7wt%Cu), while Cu concentration (2,2 and 3,1wt%Cu) do not form columnar-dendrite microstructure.

    Tipe dokumen: Artikel
    Uncontrolled Keywords: unidirectional solidification, free convection, columnar-dendrite
    Subjects: Teknologi > Teknik elektro, Teknik Nukllir
    Teknologi > T1 Teknologi (Umum)
    Divisions: Fakultas Teknik > S1 Teknik Elektro
    Depositing User: Users 388 tidak ditemukan.
    Tanggal Deposit: 28 Feb 2012 13:15
    Last Modified: 28 Feb 2012 13:15
    URI: http://eprints.umk.ac.id/id/eprint/104

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